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      <title>冷酷的算力：当AI芯片学会了“深呼吸”</title>
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      <description>深圳锐盟半导体近日完成近亿元A轮融资，其核心压电MEMS主动散热技术解决了AI终端算力飙升带来的发热瓶颈。通过与传音、飞荣达等产业巨头的深度绑定，锐盟正推动散热方案从传统的被动传导向芯片级主动微系统转型，重塑AI硬件的性能上限。</description>
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